| Feature | Description |
|---|---|
| Cooling Method | Semiconductor + air cooling for efficient heat dissipation |
| Attachment Mechanism | Magnetic or back-clip design for secure, non-damaging grip |
| Smart Control | AI Gear Switch adjusts cooling based on device temperature |
| Power Output | 20–27 W cooling capacity |
| Compatibility | Fits phones 62 mm–105 mm wide |
| Weight | Approx. 95.4 g |
| Materials | Silicone, TPU, plastic, leather for protective build |
| Performance | Provides fast and noticeable temperature drop |
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